🕤 ✡️ 🌧️ 20 promising high-speed communications products 👩‍👩‍👦‍👦 📊 🐓

We offer you a selection of 175 high-tech companies represented at DesignCon 2020.

In addition to keynote presentations, expert panels, technical papers, IEEE crediting sessions and educational tracks, DesignCon 2020 included many demos and information stands at the exhibition site. We present to your attention 20 hardware and software companies offering samples of what is trending in the world of high-speed data transmission, telecommunications, interconnects, test equipment and modeling tools, as well as what eluded your attention at the celebration of the 25th DesignCon Anniversary.

eTopus Technology

Named after the visualization of the electronic octopus, eTopus is developing ultra-high-speed mixed IP semiconductor networks for high-performance computing systems and data center applications. The ultra-high-speed serializer / deserializer pair of their production is intended for use in data storage systems, corporate and hyperscale data centers.

At Designcon2020, eTopus showcased its Western Digital ASIC using the eTopus Ethernet connection. I spoke with Harry Chan, founder and CEO of eTopus, about their booth. Here's what he said: “This demo shows the connection between non-volatile memory via Ethernet fiber. In this installation, our customer uses an SST hard drive enclosure. They also have a server that connects to a Mellanox 100G switch connected to a distributor. There is a chip inside the distributor, which our client uses as a built-in memory controller through a cable that receives traffic from the server and connects it to all drives. We demonstrate read / write operations to show how close their speed is to maximum by measuring I / O per second (or IOPS). How do you see,bandwidth is impressive. The theoretical limit that can be reached is 2.8 million IOPS. We show that one of the systems reaches 2.67 million IOPS. It does not reach the theoretical limit, not because of the limitation of the chip, but because the server does not have enough power. For our part, we are using the eTopus IP serializer / deserializer pair, which is located in our 28 gigabit IP-ePHY. ”

Keysight

Keysight has hosted many demos on hardware that meets the requirements for transmitters (Tx) and receivers (Rx) DDR5, PCIe 5.0 testers, USB 4.0 connections, and devices for measuring signal integrity and power. As part of the “Connecting to a data center” section, the company introduced a platform for testing and verifying 4-level amplitude-pulse modulation 400GE (PAM4). In addition, as part of this application-specific section, a 100 GB error analysis system with direct error correction (FEC) was shown. Finally, the PAM4 400G amplitude-pulse modulation module isolated real-time bit error rate values on all electric lines, which allowed us to evaluate the performance of direct error correction for PAM4 encoded signals.

TE Connectivity

In addition to demonstrating a large family of connections for backplanes and 5 Gb / s coaxial connectors, TE Connect has conducted several demos related to joint packaging in sockets, 5th generation communication technologies, power supply, and thermal management.

Getting rid of unwanted heat can be a problem in any electronic design, but this is especially true for high-speed signals, which usually emit more heat on the chip and board. A thermal bridge is usually an unwanted thermal path in a circuit of a circuit board. If the component has a higher thermal conductivity than the surrounding materials, this creates the path of least heat transfer resistance. This leads to a general decrease in the thermal resistance of the object.

Today, thermal pads and gaps are used to reduce the formation of unwanted thermal bridges in electronic circuits. TE Connectivity claims to have new thermal bridging technology that delivers twice the thermal resistance compared to traditional technologies. These solutions with thermal bridges are characterized by an almost zero gap between the plates in the bridge structure. This improves the ability of the system to transfer thermal energy. In addition, this minimizes the level of compression required to transfer heat along the path.

Rohde & schwarz

Rohde & Schwarz demonstrated a system for debugging signal integrity by decomposing jitter in its oscilloscopes. A new feature in the company's oscilloscopes helps development engineers gain a deeper understanding of the individual components of jitter in the signals. Now they can split jitter into random and deterministic components and view the results for more efficient debugging. The company decomposition algorithm uses a model of parametric signals for accurate measurements and additional presentation of the results. One result is a sequence of measurement data even for relatively short signal sequences, plus various information - for example, on a step-by-step characteristic or on the difference between vertical and horizontal periodic jitter.

Cadence design systems

Digital transformations in the main areas of design made it possible to use advances in the field of hyperconnection and artificial intelligence - from edge computing to cloud technology. This trend, in turn, gave impetus to the development of custom systems and systems on a chip, optimized for specific requirements and applications. In response to this trend, Cadence believes that we are in the era of intelligent systems engineering.

All of the company's tool kits are used in this intelligent system design for advanced electromagnetic, electronic, and thermal analysis, advanced packaging for integrated circuits, and cross-platform designs to enable integrated circuits with advanced DDR IP. One of the demos on the show floor focused on their Virtuoso RF toolkit, a collaborative design environment for RFIC, RF modules, and batch design. In another demonstration, tPCB / packet level analysis toolsets and signal integrity were demonstrated.

Takachi

The Japanese company showed off an impressive range of brightly colored electronic and industrial enclosures, including aluminum, plastic, manual, cast aluminum, stainless, 19-inch rack-mount enclosures, new IP67 / IP65 plastic enclosures for tilting and medical applications, and much more. Did you know that Takachi can custom-make enclosures using CNC machines, inkjet printing and CAD systems?

Teledyne lecroy

Like many exhibitors, Teledyne LeCroy held several technical seminars and lessons, in particular, they hosted an event on the topic “Open Source Software Tools to Ensure Signal Integrity”. This workshop was conducted by Peter Pupalajkis, vice president of technology development company. He had just published through Cambridge the book S Signal Integrity Parameters. Some of you still remember the S-parameters from mathematics and circuit theory as a way of describing the electrical behavior in electrical systems with introduced stimuli. What makes Peter’s book unique is its open source companion software, which is a welcome alternative to existing proprietary software.

Unsurprisingly, Teledyne LeCroy offers S-parameter measurement systems to further assist designers and testers. During the show, the company demonstrated its support for the recently introduced Compute Express Link (CXL) protocol on its Summit PCI Express protocol analyzers (PCIe).

Dino-lite

The exhibition featured several companies demonstrating their technologies in the field of digital microscopes, including Dino-Lite, PacketMicro and others. Dino-Lite is a trademark of Omano Microscopes. The company's portable digital microscopes and eyepiece cameras provide high-quality video communications from PC and Mac. Most models provide impressive magnification with features like measurement and adjustable polarization. The included software makes it easy to take pictures, record videos, manage images, and save and send your discoveries by email.

Molex

Molex and Spectra7 Microsystems introduced 400GB active copper compounds this year. Spectra7 Microsystems supplies analog semiconductor products for the broadband market, while Molex is the supplier of high-performance connections. Recently, many customers of connection systems have applied for longer active copper versions of the existing passive copper cable assemblies QSFP-DD (four-component cable assemblies with double density). The Molex system, together with Spectra7's GaugeChanger technology, claims to provide up to 12 times less power consumption while delivering significant cost savings compared to optical solutions for hyperscale customers. Obviouslythat in 2020, the United States will begin large-scale deployment of network equipment with a data transfer rate of 400 Gb / s.

The stand that caught my attention was presented at the Open 19 Backplane Cabling Through Packet Infrastructure exhibition. These comments were shared by Liz Hardin, Product Manager for Enterprise at Molex: “Molex, in collaboration with Packet, is demonstrating a packet hardware platform - an Open19-based system.” Support for this platform is based on the use of Impel-based cable assembly, which is divided into 2 QSFP slots, providing signal transmission through PAM4 at a speed of up to 56 Gb / s per line with the possibility of transferring excess signal from a standard switch. "Packet collaborates with ASRock in the field of server racks and in this demonstration show three versions: t3.small.x86, micro-servers based on AMD EPYC 3151 with two nodes per block; c3.small.x86, micro-server based on two nodes per block; and c3. medium.x86,single-socket AMD EPYC 7002 (Rome) in a unit supporting PCIe Gen4 with OCP 3.0 architecture. "

Gigatest labs

GigaTest Labs offers systems and services for the study, measurement and characterization of high frequency connections. They have a variety of sensors with single, double and deep access, as well as measuring stations used for measurements on printed circuit boards, in the radio frequency range and on large boards with a small pitch. Typically, these measurement stations are paired with an OTDR, a vector network analyzer, or an oscilloscope to measure signal integrity. The heart of the measuring system is micro-positioners and low-profile three-axis positioners, which are mounted in a vacuum and have flatness adjustment for measurement on the device under test.

The probe station GTL5050 is designed for two-way sensing. Instead of trying to take measurements with the board installed vertically, this measuring station provides 2 measuring stations in one - from the upper and lower sides, and the entire station can be rotated 180 degrees, which provides quick tuning and preliminary configuration.

Blue clover devices

A few years ago, Blue Clover Devices launched the Production Line Tool (PLT), a cloud-based instrument for automating equipment testing. Since then, the PLT has been complemented by an in-circuit tester (ICT), which helps customers run their equipment faster. PLT is a box that downloads firmware, runs automated tests, and writes the results to the cloud. It is designed to meet the needs of developers throughout the product life cycle. After the IoT device is designed and tested on the PLT, identical boxes are sent to the production line for programming and testing on a production scale. The development team can see the results directly from the production line and get ahead of the problems,which may delay the assembly of the product.

ICT is a box with vertical levers supporting a switching clip. To conduct in-circuit testing on a personalized printed circuit board, the custom-made cartridge with a spring contact (Pogo Pin Cassette) is placed in the ICT.

Vsi labs

Last year, VSI Labs, an unmanned vehicle research company, sent its unmanned research vehicle on a 2,000-mile trip from Minneapolis, Minneapolis to Santa Clara, California, where the Drive World Conference was held. The goal of this unprecedented project is to test the benefits of using high-definition maps and advanced GPS technology to improve the performance and safety of off-road driving applications. The team also hopes to better understand how these technologies work in various terrain, weather and driving conditions.

For more than two years now, VSI has been testing its test unmanned vehicles on public roads. This year at DesignCon, they showcased their IR sensor technology. In addition, Sarah Sargent, an engineering project manager, made a presentation at the Chiphead Theater on the key components of automated vehicles and was part of the Women and Minorities in STEM panel.

Rambus

Rambus is a provider of chip-based interface products and services, including physical layer circuits with dual-speed memory controller interfaces (such as DDR 1 through DDR 5) and GDDR. This year, GDDR, serializer / deserializer pairs and HBM IP cores, as well as MACsec / IPsec protocol suites for modern data centers and network applications, were presented at the exhibition. In addition, technical training was held on topics such as 5G interface solutions, alternative interface options for the architecture of chipsets, memory solutions for AI and machine learning, interface solutions for corporate and hyper-scale data centers, new requirements for automotive interfaces and solutions for three-dimensional integrated circuits.

High-speed connections are key to the productivity and growth of data centers, given their interaction with cloud services, IoT devices, video streaming, large amounts of data, wireless networks, e-commerce and social networks. This year, Rambus introduced three types of multi-protocol physical layer circuits with a serializer / deserializer pair: 28G, 32G, and 112G

Xilinx

Xilinx demonstrated several samples of high-speed serial architecture, as well as stands related to signal integrity and power, and memory interfaces. Experts from Xilinx and other companies held a technical session during which they reviewed specifications for designing components for electrical serial communication channels beyond 112 Gb / s. Based on the requirements of compatibility and scalability, electrical solutions for lines over 112 Gbit / s should be studied in configurations based on printed, orthogonal and cable backplanes. However, the design objectives of key components for lines above 112 Gb / s are unclear. As an example, two sets of recommendations were proposed for designing components for 224 Gb / s copper transmitters for smaller chassis / boxes and larger chassis.This was the topic of a technical session.

The demonstration featured a 7-nm 112 Gb / s PAM4 Xilinx test chip, which runs on several 112 Gb / s PAM4 transceivers. Channels run from the adaptive Xilinx Computing Chip Acceleration Platform (ACAP) through Samtec's NovaRay terminal to the ExaMax backplane connector using a 34 AWte Samtec twinax cable. All of this was connected using the bracket to secure the panel to the 1 meter cable connection of the 30 AWG backplane, running directly through the inexpensive and less complex circuit board.

The channel return path was repeated back to the Xilinx 112 Gbit / s PAM4 7nm ACAP test chip, which processes data to display bit error rate information.

Samtec

Firstly, Istvan Novak, representing Samtec, was named "DesignCon Engineer of the Year". You can read about why he received this award here. Secondly, Samtec presented at the exhibition several demo versions of their products, including Flyover technology, which connects the front and backplane with intermediate boards with PAM4 support and operates at a speed of 112 Gb / s, a scalable silicon test platform for AI working with 32 GT / s, high-performance test solutions with a frequency of up to 70 GHz, as well as Direct Connect - cable systems technology for connecting to silicon chips.

A few years ago, Samtec introduced its Flyover Cable System as another signal path through a printed circuit board. According to company representatives, Samtec’s Flyover design overcomes the limitations of traditional signal boards and hardware solutions, resulting in a cost-effective, high-performance option for operating at speeds of 28 Gb / s and higher. The demonstration at the stand showed the data transfer technology from the middle to the cable PAM4 backplane with a speed of 112 Gb / s. In particular, 4x data transmission paths were connected between several 112GB servers with PAM4 via two NovaRay cable assemblies and a long-range ExaMAX trunk cable.

Ansys

High-speed electronics design software was the focus of Ansys at the show. Their approaches were based on 5G, ADAS, IoT and other wireless technologies, as well as digital system technologies requiring a high level of integration, low power consumption and small electronics. Design engineers with these limitations — as well as high limits on response time and noise level in printed circuit boards, electronic modules, and complex connections — require multi-functional modeling tools to balance and optimize system performance.

One of the company's stands was designed to simulate signal and energy integrity, as well as to simulate electromagnetic interference. Another stand specialized in the reliability of electronics (see. Figure). Structural and thermal integrity are critical when designing modules and circuits that affect product reliability and life cycle. The thermal effect on the structure, especially on the microchip, is a key factor in the choice of material, cooling and form factor, which ultimately determine the size, weight and cost of the final product. For developers of modules and systems, it is critical to determine the thermal load on the system. This requires thermal and mechanical analysis tools that will determine the structural effect on the module.

Anritsu

Anritsu, a global provider of communications testing and measurement solutions, has demonstrated a line of signal integrity systems. At the exhibition, testing instruments and new technologies for testing structures using PCI Express (PCIe 3.0 / 4.0 / 5.0), Ethernet PAM4, and other high-speed connection technologies were presented. Applications for these test instruments included chipsets, cables, interconnects, and systems.

The company introduced SI measuring systems on a display with a frequency of 100 GHz. But I was attracted by the new PCIe testing platform, which supported receiver stress tests with a load of the PCIe 5.0 Base / CEM specification. At the center of the demonstration was the MP1900A Series signal quality analyzer with calibration software for the base specification and bit error rate software that supports the SKP filter. Using this system, engineers were able to configure the measurement environment for the early development of PCIe 5.0 IP and devices.

Rozenberger

Rosenberger (North America) is a supplier of RF connectors, low-frequency and high-frequency cable assemblies, test and measurement devices, automotive products, fiber-optic solutions and custom copper assemblies. Their products are used in wireless technologies, telecommunications, tests and measurements, automotive, medical, military, industrial systems and data transmission systems.

Among the many exhibits presented at the exhibition were solderless printed circuit boards that work well at frequencies up to 110 GHz. The connectors on these circuit boards are assembled using screws. Solderless connectors are used for high-performance applications. They are 30-degree angular connectors designed to provide low return loss for frequencies up to 110 GHz, as well as for single-layer or multi-layer printed circuit boards, where the microwave layer is on top.

Amphenol ICC

Amphenol ICC, a division of Amphenol, provides communications solutions for the information, communications and commercial electronics markets. At the exhibition, the company presented its high-speed backplanes, input-output systems, data storage systems, servers, mezzanine boards and power devices. Several demos of the company's products were presented: OverPass on 56G, 112G Mini Cool Edge and 56GB using Lyn QD and LinkOVER, which are distinguished by excellent characteristics in their OverPass products. LinkOVER is a biaxial connector system above a circuit board that provides system designers and design engineers with the ability to bypass circuit board tracks when transmitting high-bandwidth signals in next-generation board-to-board applications,“System-system” or “chip-chip”. This technology supports data rates from 10 Gb / s to more than 112 Gb / s PAM4 per band with high signal to noise ratio and low EHF. LinkOVER's PCB mounting solution, which provides direct compression, eliminates the need for additional cards, minimizing transitions and losses in system budgets. LinkOVER is available in screw and surface mount frame configurations. This product is an ideal solution for 100G / 200G / 400G, lnfiniband, PCle, chip communication and 5G systems.eliminates the need for additional cards, minimizing conversions and losses in system budgets. LinkOVER is available in screw and surface mount frame configurations. This product is an ideal solution for 100G / 200G / 400G, lnfiniband, PCle, chip communication and 5G systems.eliminates the need for additional cards, minimizing conversions and losses in system budgets. LinkOVER is available in screw and surface mount frame configurations. This product is an ideal solution for 100G / 200G / 400G, lnfiniband, PCle, chip communication and 5G systems.

Testequity

Designing the latest and largest interconnect and circuit board technologies requires a lot of analytical and testing equipment. One way to manage the cost of expensive equipment is to rent or use previously acquired analyzers and testers. TestEquity addresses this need by providing fully functional and calibrated equipment equipped with all accessories and instruction manuals. In addition, the company sells new test equipment, as well as its own test chambers. TestEquity is an authorized distributor of Keysight, Tektronix, Keithley and Rohde & Schwarz equipment.

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20 promising high-speed communications products